A bonding guide for placement of an orthodontic apparatus comprises a tray with a tray surface that is configured to be positioned relative to an occlusal surface of at least one tooth in a dentition of a patient. The bonding guide includes a pin with at least one finger at a free end of the pin. The at least one finger is configured to engage an orthodontic apparatus. A hinge is connected to the pin and moves to position the pin relative to the tray. The pin is movable about the hinge between an open position and a closed position when the pin is in the closed position. The pin defines a predetermined treatment location of an orthodontic apparatus relative to a tooth.
