FORMULATIONS ANTIMICROBIENNES TOPIQUES CONTENANT DES IONS CUIVRE MONOVALENTS ET SYSTÈMES POUR GÉNÉRER DES IONS CUIVRE MONOVALENTS

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专利权人:

Sami Shamoon College Of Engineering (R.A);Silberstein, Eldad;Saphier, Oshra;Shotland, Yoram;Popov, Stanislav;Saphier, Magal

发明人:

SAPHIER, Oshra,SHOTLAND, Yoram,POPOV, Stanislav,SAPHIER, Magal,SILBERSTEIN, Eldad

申请号：

EP17877956

公开号：

EP3551195A4

申请日:

2017.12.05

申请国别(地区):

EP

年份:

2020

代理人:

摘要：

The present invention relates to antimicrobial formulations. More particularly, the invention relates to monovalent copper-containing and/or monovalent copper-generating products for healing wounds and burns, and particularly for chronic wounds, prevention of wound infections and infections in various implants as well as medical/surgical devices.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/