Weng Foong Yap;Dominic Koey Poh Meng;Zhiwei Gong;Kesvakumar V. C. Muniandy
发明人:
Dominic Koey Poh Meng,Zhiwei Gong,Kesvakumar V. C. Muniandy,Weng Foong Yap
申请号：
US13292103
公开号：
US08980696B2
申请日:
2011.11.09
申请国别(地区):
US
年份:
2015
代理人:
摘要：
A method of packaging a semiconductor die includes the use of an embedded ground plane or drop-in embedded unit. The embedded unit is a single, stand-alone unit with at least one cavity. The embedded unit is placed on and within an encapsulation area of a process mounting surface. The embedded unit may have different sizes and shapes and a number of different cavities that can be placed in a predetermined position on a substrate, panel or tape during processing of semiconductor dies that are embedded into redistributed chip package (RCP) or wafer level package (WFL) panels. The embedded unit provides the functionality and design flexibility to run a number of embedded units and semiconductor dies or components having different sizes and dimensions in a single processing panel or batch and reduces die drift, movement or skew during encapsulation and post-encapsulation cure.
