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TRANSFORMABLE MODULAR DEVICE FOR HIP SURFACE REPLACEMENT
专利权人:
发明人:
TANDIYA Dr Nitesh Kumar
申请号:
IN3356/MUM/2015
公开号:
IN2015MU03356A
申请日:
2015.09.01
申请国别(地区):
IN
年份:
2017
代理人:
摘要:
The invention relates to a modular device or implant, particularly transformable modular device or implant (10) which is designed for implantation in the Ball and Socket Joints particularly for Hip Joint Replacement. The modular device (10) has plurality of modular reamers (107 and 108) and replacing components (109 and 110) with cable wires (113) in the foldable metallic petals (119). The said cable wires (113) facilitate equal weight distribution, thus making the implant (10) more stable and facilitate better weight distribution across surface. Fig 1
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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