LLORET SOLER, JUAN,SANCHO DURA, JUAN,RUBIO GUIVERNAU, JOSE LUIS,MARGALLO BALBAS, EDUARDO,CIFUENTES, ANDRES,UNGAR, BLAIR,ZINOVIEV, KIRILL,LANDLES, WILLIAM KENNEDY
申请号：
CA2975945
公开号：
CA2975945C
申请日:
2016.02.05
申请国别(地区):
CA
年份:
2019
代理人:
摘要：
A chip package includes a housing, one or more electrical connections coupled to an exterior of the housing, a photonic integrated circuit, and a scanning unit. Both the photonic integrated circuit and the scanning unit are disposed within the housing. The photonic integrated circuit has at least one waveguide designed to guide a beam of light. The scanning unit is designed to laterally scan the beam of light across a focal plane outside of the housing. The scanning unit is aligned with the photonic integrated circuit such that the beam of light is coupled between the photonic integrated circuit and the scanning unit.
