PROBLEM TO BE SOLVED: To provide an imaging apparatus that reliably and easily establishes electric connection between an imaging element chip and a circuit board, and achieves downsizing thereof.SOLUTION: An imaging apparatus 40 includes: a plurality of inner leads 48 arranged so as to extend from a side surface of an imaging element 41 and a circuit board 43 disposed at a position adjacent to the imaging element 41, in which a plurality of terminal connection pads 50 (50a, 50b, 50c, 50d, and 50e) electrically connected to the plurality of inner leads 48 by solder, respectively, are arranged in an end portion of the circuit board. In the imaging device 40, when each of the inner leads 48 of the imaging element 41 is connected and fixed to each of the terminal connection pads 50, the terminal connection pad 50c and the terminal connection pad 50a, which are connected to adjacent inner leads 48, are disposed on a first surface 43a and a second surface 43b, respectively, and so on. The terminal connection pads 50a and 50b, which are adjacent to each other across an inner lead 48, are disposed on the first surface 43a, and the terminal connection pads 50c, 50d, and 50e are disposed on the common second surface 43b.
