Andrew J. Ries,Jeffrey O. York,Stephen R. Belcher,Jeffrey M. Jelen
申请号：
US12116705
公开号：
US08216134B2
申请日:
2008.05.07
申请国别(地区):
US
年份:
2012
代理人:
摘要：
An implantable medical device is manufactured with a hermetically sealed housing and a modular assembly enclosed within the housing. The modular assembly includes a circuit board, an electronic component mounted on a top surface of the circuit board, and a wall formed having an outer surface and an inner surface separated by a top edge and a bottom edge, the wall bottom edge positioned against the circuit board such that the wall encircles the electronic component coupled to the circuit board. The wall top edge is coupled to the housing a ferrule in one embodiment.
