The invention relates to a method for assembling an adhesive device comprising a first matrix-forming material with holes and a second material, the method comprising: (a) compose the first matrix-forming material with holes； (b) compose the second material with a Tm lower than the Tm of the first material, while enabling increase in the Tm of the second material； (c) assemble the adhesive device by filling the holes of the first matrix-forming material of step (a) with the deformable second material of step (b) at a temperature where the second material is deformable and the first material is non-deformable； (d) increase the Tm of the second material.
