Mark J. Zdeblick,Benedict James Costello,Jeremy Frank,Marc Jensen,Todd Thompson,Mohammed Z. Islam
申请号：
US13619055
公开号：
US20130018434A1
申请日:
2012.09.14
申请国别(地区):
US
年份:
2013
代理人:
摘要：
An implantable integrated circuit structure comprising a conformal thin-film sealing layer for hermetically sealing circuitry layers is provided. Also disclosed are electrode structures, leads that include the same, implantable pulse generators that include the leads, as well as systems and kits having components thereof, other implantable devices utilizing the structures, and methods of making and using the subject structures.
