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光沢度に優れためっき付き銅合金板
专利权人:
三菱伸銅株式会社
发明人:
熊谷 淳一,船木 真一
申请号:
JP20130143454
公开号:
JP6141708(B2)
申请日:
2013.07.09
申请国别(地区):
日本
年份:
2017
代理人:
摘要:
PROBLEM TO BE SOLVED: To provide a plating-fitted copper alloy sheet for a lead frame having homogeneous and satisfactory Ag or Ni plating glossiness, and a method for producing a Cu-Fe-P based copper alloy mother sheet used for producing the plating-fitted copper alloy sheet.SOLUTION: A plating-fitted copper alloy sheet comprises: a copper alloy mother sheet having a composition consisting of, by mass, 1.5 to 2.4% Fe, 0.008 to 0.08% P, 0.01 to 0.5% Zn, and the balance that is Cu and inevitable impurities, in which the thickness of a work-affected layer on the surface is 0.1 to 0.5 μm, crystal grain sizes satisfy 0.05 to 0.5 μm, and a ratio of the maximum height roughness (Rz) of the surface of the work-affected layer to the root-mean-square roughness (Rq),(Rz/Rq) satisfies 6.5 to 8.0; and a Ag plating layer or a Ni plating layer formed on the work-affected layer.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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