A two-phase adhesive composition and selective debonding agent are described. The adhesive composition comprises a substantially continuous first phase comprising a pressure sensitive adhesive and a discontinuous second phase comprising crosslinked silicone gel microparticles. When applied, the selective debonding agent is absorbed by the gel microparticles. The gel microparticles change size or shape and facilitate debonding the adhesive from a substrate by decreasing the contact area between the adhesive and the substrate. Methods to selectively debond pressure sensitive adhesive compositions, methods of making the pressure sensitive adhesive compositions, articles that utilize the pressure sensitive adhesive composition, adhesive systems, and kits that include an article containing the pressure sensitive adhesive composition and the selective debonding agent, are also described.
