Johannes Wilhelmus Weekamp,Vincent Adrianus Henneken,Alfons Wouter Groenland,Marcus Cornelis Louwerse
申请号：
US15305414
公开号：
US20170043375A1
申请日:
2015.05.05
申请国别(地区):
US
年份:
2017
代理人:
摘要：
Disclosed is an ultrasonic transducer assembly comprising an ultrasonic transducer chip (100) having a main surface comprising a plurality of ultrasound transducer elements (112) and a plurality of first contacts (120) for connecting to said ultrasound transducer elements； a contact chip (400) having a further main surface comprising a plurality of second contacts (420)； an backing member (300) comprising ultrasound absorbing and/or scattering bodies (310), said backing member comprising a first surface (302) on which the transducer chip is mounted and a second surface (306) on which the contact chip is mounted； and a flexible interconnect (200) extending over said backing member from the main surface to the further main surface, the flexible interconnect comprising a plurality of conductive tracks (210), each conductive track connecting one of said first contacts to a second contact. An ultrasound probe including such an assembly, an ultrasonic imaging system including such an ultrasound probes and manufacturing methods of such an assembly and probe are also disclosed.
