An implantable lead includes a lead body having a proximal end portion and a distal end portion with a connector located at the proximal end and an electrode located at the distal end. The implantable lead further includes a coil conductor that has spiral sections wound within a lumen of the lead body and couples the lead connector to the electrode. The coil conductor has an insulation material provided on at least a segment of the coil conductor. The insulation material has a dielectric constant set such that the coil conductor forms a distributed band stop filter when exposed to a known RF magnetic field. The coil conductor comprises a filar wound into the spiral sections. The filar of the coil conductor has an insulation coating provided thereon with the insulation coating forming a dielectric layer between adjacent spiral sections of the filar.
