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LASER SELECTIVE CUTTING BY IMPULSIVE HEAT DEPOSITION IN THE IR WAVELENGTH RANGE FOR DIRECT-DRIVE ABLATION
专利权人:
R. J. Dwayne Miller
发明人:
R. J. Dwayne Miller
申请号:
US13240531
公开号:
US20120041428A1
申请日:
2011.09.22
申请国别(地区):
US
年份:
2012
代理人:
摘要:
A method of laser processing of materials and specifically laser induced ablation processes for laser removal of material by impulsive heat deposition (IHD) by direct and specific excitation of short lived vibrations or phonons of the material in such a way as to not generate highly reactive and damaging ions through multiphoton absorption. The heat deposition and ensuing ablation is achieved faster than heat transfer to surrounding tissue by either acoustic or thermal expansion or thermal diffusion. The deposited laser energy is channeled into the ablation process to drive the most efficient ablation process possible with minimal damage to surrounding areas by either ionizing radiation or heat effects.
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