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Method of coating microneedle
专利权人:
Seiji Tokumoto
发明人:
Seiji Tokumoto,Toshiyuki Matsudo,Tetsuji Kuwahara
申请号:
US12599394
公开号:
US08771781B2
申请日:
2007.10.18
申请国别(地区):
US
年份:
2014
代理人:
摘要:
The present invention provides a method of coating microneedles by which the microneedles mounted on a microneedle device are coated accurately and easily in a mass-producible manner. In this method, a microneedle device (22) with a plurality of microneedles (21) is mounted on a table (23), while a mask plate (25) with a plurality of apertures (24) is fixed to a frame member (26), and a coating solution (27) is drawn in the direction of arrow A on the mask plate (25) using a spatula (28) to fill the apertures (24) with the coating solution. The microneedles (21) are inserted in the apertures (24) before or after the filling of the apertures (24) with the coating solution (27) to coat the microneedles (21).
来源网站:
中国工程科技知识中心
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