Laser processing apparatus, bone joining method, implant material, implant material manufacturing method, and implant material manufacturing apparatus

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专利权人:

国立大学法人北海道大学;三菱電機株式会社

发明人:

金岡 優,荻田 平,村井 融,但野 茂,東藤 正浩

申请号：

JP2008530922

公开号：

JP4997452B2

申请日:

2007.08.21

申请国别(地区):

JP

年份:

2012

代理人:

摘要：

An osseointegration method of integrating bone and implant material includes, for integrating the bone and the implant material shortly and easily, a drilling step of drilling a hole in a bone 51 or implant material 52 through to a junction of the bone 51 and the implant material 52 by applying a laser beam to the bone 51 or the implant material 52, and an integrating step of integrating the bone 51 and the implant material 52 by applying a laser beam to the junction of the bone 51 and the implant material 52 through the hole drilled at the drilling step.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/