Xiaohong Tang,William C. Thiebolt,Christine A. Frysz,Keith W. Seitz,Robert A. Stevenson,Richard L. Brendel,Thomas Marzano,Jason Woods,Dominck J. Frustaci,Steven W. Winn
申请号：
US15016368
公开号：
USRE047624E1
申请日:
2016.02.05
申请国别(地区):
US
年份:
2019
代理人:
摘要：
A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.
