A wafer adapted for use with an ostomy appliance includes a backing layer, an adhesive layer applied to the backing layer and providing an adhesive surface, and a liner system disposed over an entirety of the adhesive surface. The adhesive surface includes a mid-section. The liner system includes a first side liner placed on a first lateral side of the mid-section of the adhesive surface, a second side liner placed on a second lateral side of the mid-section of the adhesive surface, and a third middle liner having folded edge portions and covering the mid-section of the adhesive surface.
