Bushan K. Purushothaman,Kenneth C. Gardeski,Suping Lyu,Yaling Fan,Peter M. Seiler
申请号：
US14263241
公开号：
US20150306382A1
申请日:
2014.04.28
申请国别(地区):
US
年份:
2015
代理人:
摘要：
Implantable medical leads include a conductive interconnect within a high frequency shunt that dissipates high frequency current. The conductive interconnect provides an elasticity that allows a drive shaft to rotate and translate during implantation of the lead while the conductive interconnect maintains physical contact with the drive shaft and with a shunt electrode before, during, and after the implantation. The conductive interconnect may provide a low friction that presents a smooth rotation and translation of the drive shaft to provide an acceptable tactile feedback during implantation. The conductive interconnect also provides a high electrical conductivity so that a substantial amount of high frequency current flows through the conductive interconnect to the shunt electrode. The conductive interconnect may include a polymer filler that partially penetrates into the interstitial spaces of the conductive interconnect to assist in maintaining the physical integrity of the conductive interconnect.
