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Interdigital pad
专利权人:
发明人:
Jun Nakamura
申请号:
US14404981
公开号:
US09681976B2
申请日:
2014.04.09
申请国别(地区):
US
年份:
2017
代理人:
摘要:
An interdigital pad for toes having a larger diameter engaging ring fitted on the big toe, a smaller diameter engaging ring fitted on the fourth toe, a base connecting said engaging rings and positioned on the sole of the foot, a projection fitted between and caught by the second and third toes, said base and two engaging rings forming an arched edge contacting the roots of respective toes, and a thickness of a lower ring of said larger diameter engaging ring and a thickness of the base of the second toe being thicker than a thickness of a portion located from the third to the fifth toes, so a height from the floor surface at a side of the little toe and fourth toe is a higher than at a side of the big toe.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
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