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Thermal management system and method for medical devices
专利权人:
发明人:
Kevin P. McLennan,John C. Hoenninger, III
申请号:
US15592059
公开号:
US10034975B2
申请日:
2017.05.10
申请国别(地区):
US
年份:
2018
代理人:
摘要:
A medical device includes a housing, a power supply, a thermally conductive mounting clamp, a heat shield, and at least one fastener. The housing includes a handle. The power supply is disposed within the housing. The thermally conductive mounting clamp is attached to an outer surface of the housing. The heat shield is disposed within the housing adjacent to the power supply. The heat shield is disposed against at least one interior surface of the handle. The at least one fastener passes through at least one opening in the housing and is in thermally conductive contact with the thermally conductive mounting clamp. Heat generated by the power supply is configured to dissipate from the power supply, through the heat shield, through the at least one fastener, and into the thermally conductive mounting clamp.
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