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METHODS AND DEVICES FOR SUBCUTANEOUS LEAD IMPLANTATION
专利权人:
Inc.;Medtronic
发明人:
Mary L. Cole
申请号:
US14177424
公开号:
US20150105793A1
申请日:
2014.02.11
申请国别(地区):
US
年份:
2015
代理人:
摘要:
Devices and implantation methods utilizing subcutaneous placement into a patient are disclosed for the insertion, advancement and positioning of a subcutaneous implantable medical device (SIMD) such as a medical electrical lead. The SIMD is releasably-engaged with a device in accordance with embodiments of this disclosure, and advanced from an incision of the patient to an implant location. The implantation device may be disengaged from the SIMD without moving the SIMD from the implant location.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
相关发明人
mary l. cole
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