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SUBCUTANEOUS INJECTION SYSTEM WITH ADHESIVE INJECTION SITE INDICATOR
专利权人:
QUALCOMM Incorporated
发明人:
Eugene Dantsker
申请号:
US14697483
公开号:
US20160310663A1
申请日:
2015.04.27
申请国别(地区):
US
年份:
2016
代理人:
摘要:
Described herein are subcutaneous medication delivery applicators and adhesive patches with one or more openings in the patches that designate one or more desired injection sites for subcutaneous injection of a medication. The medication delivery applicator and the adhesive patch may both include circuitry and wireless short-range communications interfaces that allow for the two devices to communicate with one another in order to determine if they are pre-associated in some manner, such as would be the case if both devices were packaged in the same injection kit. The medication delivery applicator may have some form of safety interlock that is only disengaged by the circuitry upon verifying that the two devices are pre-associated in some manner. Various other implementations are described as well.
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中国工程科技知识中心
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