PROBLEM TO BE SOLVED: To provide a mechanism for suppressing peeling of a scintillator. Kind Code: A1 A sensor substrate 101 provided with a plurality of pixels for converting light into an electric signal on a first surface 102 located on a side where a radiation 401 enters, and a side opposite to the first surface 102 of the sensor substrate. And a scintillator 116 provided in the concave portion 104 formed on the second surface 103 located at the position for converting the radiation 401 into light, and the length between the first surface 102 and the top portion 1041 of the concave portion is L. At this time, a straight line 1071 passing through a half position of the length L and parallel to the first surface 102, and a tangent line 1073 contacting the side part 1042 of the recess at a point 1072 where the straight line 171 intersects the side part 1042 of the recess. Has an angle θ of 30 ° <；θ <；60 °, the bottom 1043 of the recess and the side 1042 of the recess are continuous with a rounded portion, and a circle 1074 based on the shape of the rounded portion is formed. Radius R of R It is 10μm. [Selection diagram] Figure 2【課題】シンチレータの剥離を抑制する仕組みを提供する。【解決手段】放射線４０１が入射する側に位置する第１の面１０２に、光を電気信号に変換する画素が複数設けられたセンサ基板１０１と、センサ基板の第１の面１０２とは反対側に位置する第２の面１０３に形成された凹部１０４に設けられ、放射線４０１を光に変換するシンチレータ１１６とを有し、第１の面１０２と凹部の頂部１０４１との長さをＬとしたとき、長さＬの１／２の位置を通り且つ第１の面１０２と平行である直線１０７１と、直線１７１が凹部の側部１０４２と交わる点１０７２において凹部の側部１０４２に接する接線１０７３とのなす角度θが、３０°＜θ＜６０°であり、凹部の底部１０４３と凹部の側部１０４２とが丸みの部分を有して連続しており、当該丸みの部分の形状に基づく円１０７４の半径Ｒが、Ｒ＞１０μｍである。【選択図】図２
