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Boîtier de raccordement et sa fabrication
专利权人:
BIOTRONIK CRM PATENT AG
发明人:
LITZKE, JAN,JOHN VON FREYEND, JÖRG
申请号:
EP10190653.5
公开号:
EP2329860B1
申请日:
2010.11.10
申请国别(地区):
EP
年份:
2015
代理人:
摘要:
The housing (2) has a connection body (22) made of electrically insulating material and consisting of a cavity (21) for connecting an implantable electrode line, where the cavity is accessible from outside. A substrate (4) includes electrically conductive conductor path structures. Contact units are fixedly connected with the conductor path structures in an electrically conductive manner, where the structures are arranged in or on a substrate material of the substrate. The substrate is embedded into the connection body so that the contact units are arranged in the cavity. Independent claims are also included for the following: (1) method for manufacturing a connection housing for a medical implant (2) a medical implant comprising a connection housing.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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