An endoscopic device includes a bending operation wire configured to bend a treatment instrument bending section when pulled or loosened by an operation in a treatment instrument operation section. The bending operation wire includes a rigidity variable wire which includes a first wire portion, a second wire portion provided to a proximal direction side of the first wire portion and having a rigidity higher than that of the first wire portion, and a wire joint portion in which the first wire portion and the second wire portion are joined, the wire joint portion being placed to the proximal direction side of a proximal end of an endoscope bending section at a treatment in which a proximal end of the treatment instrument bending section is placed to a distal direction side of a distal end of the endoscope insertion section.
