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AN ULTRASOUND PHASED ARRAY PATCH ON FLEXIBLE CMOS AND METHODS FOR FABRICATING THEREOF
专利权人:
The Trustees of Columbia University in the City of New York
发明人:
KENNETH L. SHEPARD,Tiago COSTA,KEVIN TIEN,Chen SHI
申请号:
US16474986
公开号:
US20190343485A1
申请日:
2017.12.27
申请国别(地区):
US
年份:
2019
代理人:
摘要:
An ultrasound phased array integrated in flexible CMOS technology is provided. The CMOS IC chip is fabricated through various chip-thinning techniques, resulting in mechanical flexibility, robustness, and minimized mechanical loading for the piezoelectric transducers. The ultrasound phased array CMOS patch can allow for the generation of high intensity focal regions for maximum penetration in regions of interest.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
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