A method for inspecting a pressure pulse wave sensor is provided. The sensor chip includes a recess which is recessed in a direction perpendicular to the pressure-sensitive face, and the pressure-sensitive element array is formed in a portion of the sensor chip whose thickness is reduced in the direction due to the recess. The method includes: bonding and fixing the sensor chip onto the substrate so that the recess communicates with atmospheric air through only the through hole of the substrate； connecting a substrate-side terminal portion of the substrate and the chip-side terminal portion through an electrically conductive member； and performing characteristic evaluation on the sensor chip based on a signal outputted from the substrate-side terminal portion in a state in which air is sucked through the through hole of the substrate to thereby apply negative pressure to the pressure-sensitive face.
