A device for peroperative preparation of an implantable patch with suturing according to embodiments of the present invention includes a first element having one or more first through-openings configured to receive a suture, a second element movable with respect to the first element, the second element including one or more second through-openings configured to receive the suture, and a mechanism configured to position the first and second elements with respect to each other in a closed configuration in which at least one of the one or more first through-openings is aligned with at least one of the one or more second through-openings and in which the first and second elements are close enough together to hold the implantable patch between the first and second elements.
