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Microstimulator with Rigid Support Structure
专利权人:
Boston Scientific Neuromodulation Corporation
发明人:
Samuel Tahmasian,Matthew Lee McDonald,William Morgan,Rafael Carbunaru,Jillian Doubek
申请号:
US15914742
公开号:
US20180272138A1
申请日:
2018.03.07
申请国别(地区):
US
年份:
2018
代理人:
摘要:
An implantable pulse generator (IPG) is disclosed herein. The IPG may be very small compared to most IPGs and may have a volume on the order of about 3 cm3. The IPG has a separate battery compartment and electronics compartment that may be joined together by laser welding, for example. The combined battery compartment/electronics compartment is then enclosed or partially enclosed within a rigid shell made of a polymeric material. The shell provides structural stability and support for the IPG and provides a barrier against puncturing the IPG. The IPG can then be overmolded with a soft coating material such as silicone. The overmolding provides an additional layer of protection against leakage of non-biocompatible components and also enhances the comfort of the IPG. An electrode assembly may be joined to the IPG prior to overmolding, in which case the overmolding secures the electrode assembly to the IPG.
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中国工程科技知识中心
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http://www.ckcest.cn/home/

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