There is provided a fingerprint sensing device comprising: a sensing chip comprising an array of sensing elements, the sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of the sensing elements and a finger placed on a sensing surface of the sensing device； a cover layer arranged vertically above the sensing elements to cover at least a portions of the sensing elements, wherein an outer surface of the cover layer form the sensing surface of the sensing device； wherein the cover layer comprises a three-dimensional pattern configured to reduce the amount of reflected light within a predetermined sub-range of the visible range. There is also provided a method for manufacturing a fingerprint sensing device.
