An endoscope inspection system includes an endoscope inspection apparatus and a package that packages an endoscope. The endoscope inspection apparatus includes a communication connector and a processor. The processor drives an image pickup device circuit of the endoscope to receive a response signal, determines based on the response signal whether a status of an image pickup device circuit is good or poor, and notifies a result of determination. The package includes a first fixing shape portion that fixes the packaged endoscope connector and a first fitting shape portion fitted with the communication connector such that an endoscope-side communication terminal of the fixed endoscope connector is electrically connected to an inspection apparatus-side communication terminal of the communication connector.
