Jonathan M. Rothberg,Susan A. Alie,Keith G. Fife,Nevada J. Sanchez,Tyler S. Ralston
申请号：
US15177977
公开号：
US09910018B2
申请日:
2016.06.09
申请国别(地区):
US
年份:
2018
代理人:
摘要：
Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
