PROBLEM TO BE SOLVED: To provide an imaging device and an endoscope apparatus in which the heat of electronic parts mounted on a flexible substrate can be effectively radiated with a simple constitution and the size of the apparatus can be avoided from being large.SOLUTION: The imaging device is equipped with the objective optical system taking in observing light, an imaging element imaging the observing light, a flexible circuit substrate electrically connected to the imaging device and of which one part is folded and bent, a signal cable electrically connected to the flexible circuit substrate, a slit located near the signal cable and formed in the flexible circuit substrate, the first resin for bonding and fixing the folded and bent site of the flexible circuit substrate, and the second resin sealing the slit in the flexible circuit substrate and bonded to the signal cable, the first resin and the second resin have thermal conductivity, the second resin has a thermal conductivity higher than that of the first resin.COPYRIGHT: (C)2012,JPO&INPIT【課題】 簡単な構成で、フレキシブル基板に実装された電子部品の熱を効率良く逃がすことができ、装置の大型化を回避できる撮像装置及び内視鏡装置を提供する。【解決手段】撮像装置は、観察光を取り込む対物光学系と、観察光を撮像する撮像素子と、撮像素子と電気的に接続され、一部が折り曲げられた可撓性回路基板と、可撓性回路基板に電気的に接続された信号ケーブルと、信号ケーブル近傍に位置し、可撓性回路基板に形成されたスリットと、可撓性回路基板の折り曲げられた部位を接着固定する第1の樹脂と、可撓性回路基板におけるスリットを封止し、信号ケーブルに接着された第2の樹脂とを備え、第1の樹脂及び第2の樹脂は熱伝導性を有し、第2の樹脂は第1の樹脂より熱伝導性が高い。【選択図】図3
