A head of a cavity exploration device, with an integrated circuit support which has first and second surfaces and a plurality of through-holes associated with corresponding first and second conducting pads positioned on the respective first and second surfaces of the integrated circuit support, a respective conducting micro-cable is placed in the through-hole, with this micro-cable having a portion which is uninsulated for a length greater than or equal to the thickness of the support. The micro-cable is soldered to the associated first and second conducting pads. Next the micro-cable is glued to the first and second associated conducting pads. The micro-cable is molded in first and second resin layers onto the respective first and second conducting pads, with the resin layers covering the uninsulated portion of the micro-cable.
