A module for wireless communication includes: a module body which (i) is plate-shaped, has (ii) a structure having a plurality of layers, and (iii) has a circuit region; and a folded dipole which is situated circumferentially around the circuit region and has a first dipole half situated in a first level of the module body, and a second dipole half situated in a second level of the module body. The first dipole half and the second dipole half are separated by a layer of the module body, and are connected to one another in electrically conductive fashion through a first via and a second via extending through the layer.
