The present invention provides a patch package structure, which includes: a package including a first sheet material which is planar and a second sheet material which has been molded, the first and second sheet materials being sealed together in peripheral parts thereof, and a patch disposed in the package, in which the patch contains a backing, a pressure-sensitive adhesive layer laminated on at least one side of the backing, and a release liner which protects a pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer the second sheet material has been molded so as to have a protrudent part in at least a substantially central area thereof, the protrudent part having a planar outer shape larger than a planar outer shape of the release liner and having at least one recessed part d is not smaller than T, in which d is the minimum gap distance between the inner surface of the first sheet material and the inner surface of the second sheet material at the recessed part and T is a thickness of the patch and, at the boundary between the sealed part where the first and second sheet materials are sealed together and an unsealed part, the outer surface of the second sheet material rises at an obtuse angle.
