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GROUNDING OF A SHIELD WITHIN AN IMPLANTABLE MEDICAL LEAD
专利权人:
MEDTRONIC; INC.
发明人:
James M. Olsen,Michael Robert Klardie,Richard T. Stone,Chad Q. Cai,Spencer M. Bondhus,Mark J. Conroy,Timothy R. Abraham
申请号:
US14456809
公开号:
US20140350654A1
申请日:
2014.08.11
申请国别(地区):
US
年份:
2014
代理人:
摘要:
Implantable medical leads include a shield that is guarded at a termination by having a first portion and a second portion of the shield, where the first portion is between a termination of the shield at the second portion and an inner insulation layer that surrounds the filars. The first portion may reduce the coupling of RF energy from the termination of the shield at the second portion to the filars. The first and second portions may be part of a continuous shield, where the first and second portions are separated by an inversion of the shield. The first and second portions may instead be separate pieces. The first portion may be noninverted and reside between the termination at the second portion and the inner layers, or the first portion may be inverted to create first and second sub-portions. The shield termination at the second portion is between the first and second sub-portions.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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