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FEEDTHROUGH ASSEMBLY INCLUDING CHIP CAPACITORS
专利权人:
Rajesh V. Iyer
发明人:
Rajesh V. Iyer,Simon E. Goldman,Thomas P. Miltich
申请号:
US13308313
公开号:
US20130138187A1
申请日:
2011.11.30
申请国别(地区):
US
年份:
2013
代理人:
摘要:
A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening and attached to the ferrule, and a plurality of chip capacitors. In some examples, the feedthrough may include a plurality of feedthrough conductive pathways extending between an externally-facing side of the feedthrough and an internally-facing side of the feedthrough. In some examples, respective ones of the plurality of chip capacitors are electrically connected to respective ones of the plurality of feedthrough conductive pathways and electrically connected to the ferrule.
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