An image pickup apparatus includes a laminated substrate on which a plurality of electronic components configuring a driving circuit of a solid-state image pickup device are mounted and in which a plurality of conductor layers and a plurality of vias are formed, electronic component connection lands provided on a surface of the laminated substrate, any one of the plurality of electronic components being electrically connected to the electronic component connection lands, and a cable connection land provided on the surface of the laminated substrate, a plurality of signal cables being electrically connected to the cable connection land. At least one of the plurality of electronic components is embedded in a position superimposed on the electronic component connection lands or the cable connection land on an inside of the laminated substrate.
