An adhesive wearable device includes a cover assembly, a sensor assembly and an electronic module. The cover assembly includes a top cover. The top cover defines an accommodating chamber and a plurality of exhaust holes. The sensor assembly includes a sensor board, and an adhesive pad mounted under the sensor board. The sensor board defines a plurality of through-holes. A bottom surface of the sensor board is equipped with a plurality of sensor units. The adhesive pad defines an opening corresponding to the sensor units, a plurality of perforations and guiding channels extending radially from the opening to the perforations. The electronic module is disposed on and is electrically connected with the sensor board. The cover assembly covers up the sensor assembly and the electronic module. The exhaust holes are communicated with the opening by virtue of the accommodating chamber, the through-holes, the perforations and the guiding channels.
