Colvin, Jason D.,Colvin, Arthur E.,Dehennis, Andrew,Krsmanovic, Jody L.
申请号：
AU2013204149
公开号：
AU2013204149A1
申请日:
2013.04.12
申请国别(地区):
AU
年份:
2013
代理人:
摘要：
#$%^&*AU2013204149A120130502.pdf#####uilu-ll Illu u tu l5 10p 4I utIn V SPCCIllClhIO1.d-I l/104//U3 ABSTRACT A semiconductor device for harsh environments, comprising: a printed circuit board having a top surface with a plurality of gold bonding pads a light emitting diode, including: a substantially transparent substrate, a semiconductor layer deposited on a bottom surface of the substrate, a plurality of gold bonding pads, coupled to the semiconductor layer, formed on the bottom surface of the substrate, and a plurality of gold micro posts, formed on the bonding pads, bonded to the gold bonding pads of the printed circuit board an underfill layer, including a polymer and a filler, disposed between the bottom surface of the substrate and the top surface of the printed circuit board, to reduce water infiltration under the light emitting diode substrate and a substantially transparent, hemispherical diffuser, mounted to a top surface of the substrate, to diffuse the light emitted through the top surface of the substrate.7/9 50 LED DIE PRINTED CIRCUIT 20 FIG.9
