The illustrated embodiments include an apparatus to reduce or eliminate full thickness injury in tissue and to deform tissue which includes a probe or mechanism for deforming tissue, and a subsystem for selectively cooling and/or heating tissue while deformation is of the tissue is being performed. The illustrated embodiments of the invention also extend to a method to reduce or eliminate full thickness injury in tissue and to deform tissue including the steps of deforming tissue, and selectively cooling and/or heating tissue while deformation of the tissue is being performed.
