Douglas Glenn Wildes,Lowell Scott Smith,Kwok Pong Chan,Vadim Bromberg
申请号：
US15087369
公开号：
US20170288638A1
申请日:
2016.03.31
申请国别(地区):
US
年份:
2017
代理人:
摘要：
The present disclosure relates to the bulk manufacture of transducer arrays, including arrays having at least one 3D printed (or otherwise additive manufactured) acoustic matching layers. In certain implementations, the manufactured transducers include a composite-piezoelectric transducer on a de-matching layer. In one implementation, by producing multiple arrays at once on a common carrier, and by using direct-deposit additive processes for the matching layers, the described processes greatly reduce the number of parts and the number of manual operations.
