Allan Aquino,Kim Brandt,Andy Buersmeyer,David Poirier
申请号：
US16429282
公开号：
US20200000548A1
申请日:
2019.06.03
申请国别(地区):
US
年份:
2020
代理人:
摘要：
A wireless transponder device that may be used in medical procedure may be fabricated using semiconductor fabrication techniques. The electrical components of the wireless transponder device may be more resilient when compared to components that are electrically coupled using traditional electrical coupling techniques (e.g., soldering) that may be used for such devices. Such electrical components may be smaller and thereby less noticeable when the wireless transponder is physically coupled or attached to medical devices or components. The semiconductor fabrication process may be used to form a wireless transponder with a metal layer that may be carried on a substrate in which the metal layer includes an inductive portion and a capacitive portion that together may form a resonant circuit that resonates at a desired frequency. The wireless transponder may be enclosed within a pouch that is physically coupled to a medical object that may be used during the medical procedure.
