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THIN-FILM MICROMESH COVERS FOR MEDICAL DEVICES AND RELATED METHODS
专利权人:
NSVascular; Inc.
发明人:
Colin Kealey,Ian A. Cook,Vikas Gupta
申请号:
US15849469
公开号:
US20180110637A1
申请日:
2017.12.20
申请国别(地区):
US
年份:
2018
代理人:
摘要:
A thin-film covered stent device may include a thin-film mesh and a stent backbone covered by the thin-film mesh, thereby forming a dual-layer stent structure. The thin-film covered stent device may have smaller pores and a high pore density compared to conventional stents. For example, the thin-film covered stent device may have a slit length of between 50 and 250 micrometers and a pore density of between 134 and 227 pores per mm2. The thin-film covered stent device facilitates rapid healing of tissue defects such as those encountered during the endovascular treatment of an aneurysm.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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