A method for manufacturing a capacitive transducer is provided having a structure in which a vibrating film is supported to be able to vibrate. The method includes forming a sacrificial layer on a first electrode forming a layer on the sacrificial layer, the layer forming at least part of the vibrating film removing the sacrificial layer, including forming etching holes to communicate with the sacrificial layer forming a sealing layer for sealing the etching holes and etching at least part of the sealing layer. Before forming the sealing layer, an etching stop layer is formed on the layer forming at least part of the vibrating film. In the step of etching at least part of the sealing layer, the sealing layer is removed until the etching stop layer is reached.
