Salomo Murtonen,Rafael Carbunaru,Joseph M. Bocek,Gaurav Gupta
申请号：
US13774576
公开号：
US20130226266A1
申请日:
2013.02.22
申请国别(地区):
US
年份:
2013
代理人:
摘要：
An implantable medical device system includes a control module with a connector assembly for electrically coupling to a lead. The control module includes a plurality of feedthrough interconnects extending from the connector assembly to an electronic subassembly disposed in a sealed housing. The plurality of feedthrough interconnects include a first feedthrough interconnect and a second feedthrough interconnect. Impedance circuitry disposed in the control module modulates impedance associated with terminals and conductors of the lead. The impedance circuitry includes a plurality of impedance elements each coupled electrically to a different feedthrough interconnect. Each impedance element has a pre-defined impedance. The plurality of impedance elements include a first impedance element electrically coupled to the first feedthrough interconnect and a second impedance element electrically coupled to the second feedthrough interconnect. The pre-defined impedance of the first impedance element is different than the pre-defined impedance of the second impedance element.
