An improved chip assembly for use in a stapling device includes a housing assembly receivable within a reload assembly. The housing assembly includes a base member defining a cavity and an identification assembly received within the cavity. The chip assembly further includes a plug assembly configured to selectively engage the base member. The plug assembly includes a housing, a wire extending from the housing, a seal member disposed within and extending from a distal end of the housing, and first and second contact members extending through the seal member and from the housing. The seal member is configured to be frictionally received within the base member to secure the plug assembly to the housing assembly in a fluid tight manner.
