Qingfang Yao,Jordan Matthew Neysmith,Neil Hamilton Talbot,James S Little,Robert J Greenberg
申请号：
US14253203
公开号：
US09327108B2
申请日:
2014.04.15
申请国别(地区):
US
年份:
2016
代理人:
摘要：
A flexible circuit electrode array device comprising: a polymer layer wherein the polymer layer includes one or more metal traces, an electrode array one or more bond pads and the electrode array is located on the opposite side of the polymer layer. A method for backside processing of a flexible circuit electrode device, comprising: applying polymer film on a substrate processing the front side releasing the polymer film from substrate flipping over the polymer film and fixing it onto the substrate processing the backside and final releasing of the polymer film from the substrate. Another aspect of the method involves backside processing of a flexible circuit electrode device, comprising: processing the front side without releasing the polymer processing the backside by sacrificial substrate method, or by laser drilling method and releasing the polymer film from the substrate.
